Fine pattern forming method, developing/washing device used for the same, plating method using the same, and manufacturing method of thin film magnetic head using the same

A plating method comprising the steps of:

• forming an electrode film on a substrate;
• coating a resist, which contains a material generating acid by heating or light irradiation, on a substrate;
• forming resist pattern by exposing the resist through a pattern, developing the resist, and washing a developing solution out with a washing solution;
• coating a fine pattern forming material containing a material, which is cross-linked by existence of acid, on the substrate in a state where the washing solution is adhered to the substrate;
• generating acid in the resist pattern by heating or light irradiation;
• covering the resist pattern with cross-linked layer generated on interface between the fine pattern forming material and the resist pattern;
• developing a not-cross-linked layer of the fine pattern forming material by a developing solution for the fine pattern forming material;
• washing the developing solution out with a washing solution;
• immersing a surface of the substrate in a plating solution;
• and
• forming a plating film between the covered resist pattern.