Apparatus and system of chemical mechanical polishing
AssigneeUnited Microelectronics Corp.
InventorHai-Ching Chen
Life of this patent
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Abstract
Apparatus of carrier in a chemical mechanical polishing equipment comprises a carrier module for holding a wafer face down. A retaining ring and conditioning module is coupled to the carrier module, which is used for protecting the wafer edge against contact with a polishing pad in a deformed shape and executing a conditioning of the polishing pad. A first support module is coupled to the retaining ring and conditioning module, which is used for rotating, pressing down, and supplying conditioning chemicals for the retaining ring and conditioning module.
Claims13
Apparatus of carrier in a chemical mechanical polishing equipment, said apparatus comprising:
- a carrier module for holding a wafer against a polishing pad, said carrier module being rotated by a first rotating system;
- a retaining and conditioning module coupled to said carrier module and rotated independent to said carrier module, said retaining and conditioning module retaining said wafer and conditioning said polishing pad;
- and
- a conditioning support module coupled to said retaining and conditioning module, said conditioning support module rotating said retaining and conditioning module by using a second rotating system, providing said retaining and conditioning module with a down force against said polishing pad, and supplying conditioning chemicals.
Apparatus of carrier in a chemical mechanical polishing equipment, said apparatus comprising:
- a carrier module for holding a wafer against a polishing pad;
- a retaining and conditioning module coupled to said carrier module and rotated independent to said carrier module, said retaining and conditioning module retaining said wafer and conditioning said polishing pad;
- a conditioning support module coupled to said retaining and conditioning module, said conditioning support module rotating said retaining and conditioning module by using a second rotating system, providing said retaining and conditioning module with a down force against said polishing pad, and supplying conditioning chemicals;
- and
- a carrier support module coupled to said carrier module, said carrier support module rotating said carrier module by using a first rotating system and providing polishing chemicals.
Dependencies are inferred from the claim text.