Method for manufacturing high density electrical connector assembly

An electrical connector assembly adapted for interconnecting two perpendicular electronic elements, comprising:

• a receptacle comprising:
• a dielectric housing defining a plurality of spaced channels;
• a first spacer being assembled to the dielectric housing and comprising a plurality of first wafers assembled together, each of the first wafer comprising a dielectric base and a plurality of signal terminals assembled to the dielectric base for connecting with an electronic element, two first wafers defining a slot;
• and
• a plurality of circuit boards being retained in the slots of the first spacer for connecting with the terminals and received in corresponding spaced channels of the dielectric housing;
• and
• a header interconnecting corresponding circuit boards of the receptacle to another electronic element;
• wherein the header comprises an insulative housing and a second spacer assembled to the insulative housing;
• wherein the second spacer comprises a plurality of second wafers assembled together;
• wherein each of the first wafers and second wafers further includes a grounding bus mounted on the dielectric base opposite to the signal terminals;
• wherein the receptacle further comprises a fastening device for securing the first spacer to the dielectric housing.