Lead wire-processing structure
AssigneeFunai Electric Co., Ltd.
InventorsHideki Kume, Teruaki Sogawa, Takayuki Murakami
Life of this patent
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Abstract
Lead wires (10) are soldered at their one ends respectively to lands (120) on a wiring board (100) while the other ends of the lead wires are connected to an electrical part mounted on a movable member (200). A portion of each of the lead wires (10) is passed through a U-shaped notch (130) in the wiring board (100), and a loop portion (16), formed at another portion of each lead wire (10), is loosely fitted on a projected piece portion (140) of the wiring board (100).
Claims7
A lead wire-processing structure, comprising lead wires are soldered at their one ends respectively to lands formed on one side of a wiring board while the other ends of said lead wires are connected to an electrical part;
- and first portions of said lead wires, disposed in the vicinity of said one ends thereof, are extended respectively from said lands in generally contiguous relation to said one side of said wiring board, and are passed through a slit-like, U-shaped notch formed in said wiring board;
- and a second portion of each of said lead wires, extending from said U-shaped notch on said other side of said wiring board, has a loop portion formed between a U-shaped notch-passing portion of said lead wires, passed through said U-shaped notch, and a third portion of said lead wires connected to said electrical part;
- and said loop portion are loosely fitted on a projected piece portion of said wiring board disposed adjacent to said U-shaped notch.
Dependencies are inferred from the claim text.