Surface mount attachable land grid array connector and method of forming same

A surface mount attachable land grid array connector, comprising:

• a) a substrate comprising at least one layer of dielectric material having a top surface and a bottom surface;
• b) a plurality of openings in said substrate, each of said openings positioned to accept a single, resilient contact member;
• c) a plurality of resilient contact members respectively disposed in said plurality of openings, each having a first and second end, at least one of said first and second ends being semi-permanently attached to a contact pad on a first circuit member;
• d) an interposer and adhesive means located intermediate said interposer and said substrate, said interposer comprising:
• i) at least one second dielectric layer having one major surface and at least one edge;
• ii) a plurality of conductive pads, each having a first and second surface, spaced apart on said major surface of said at least one second dielectric layer, said first surface of said conductive pads being plated with at least one layer of metal, and at least a portion of said second surface of said conductive pads being readily adaptable for connection to a conductive member;
• iii) a plurality of second openings with a non-uniform cross section, each one corresponding to and aligned with one of said conductive pads;
• and
• iv) reworkable conductive material located within each one of said second openings and in electrical contact with said portion of said second surface of said conductive pads.