Optoelectronic packaging assembly
AssigneeSilicon Bandwidth, Inc.
InventorsStanford W. Crane, Jr., Zsolt Horvath
Life of this patent
Estimating the term…
Abstract
Optoelectronic packaging assemblies for optically and electrically interfacing an electro-optical device to an optical fiber and to external circuitry. An optoelectronic packaging assembly includes a submount for holding an optical bench with an electro-optical device. Electrically conductive pins provide electrical contact to the electro-optical device. The optoelectronic packaging assembly includes an optical input receptacle for receiving an optical ferrule and an optical fiber. The optical input receptacle assists optical coupling of the electro-optical device to the optical fiber. The optoelectronic packaging assembly provides for cooling using a heat-sink or a thermal-electric-cooler. Beneficially, the optoelectronic packaging assembly is sealed using a cover.
Claims71
An optoelectronic packaging assembly, comprising:
- a submount having a cavity defined by a floor, sidewalls, a back wall, and a front wall, wherein at least one of said sidewalls retains pins, said submount further including an optical input receptacle which extends from said front wall;
- a base having sidewalls with top surfaces and a front wall with a slot, wherein said base is configured to receive said submount such that said submount extends over said sidewalls of said base and such that said optical input receptacle extends from said slot;
- and
- an external cover over said submount.
An optoelectronic packaging assembly, comprising:
- a submount having sidewalls, a front wall, pins, protrusions, and an optical input receptacle, wherein said protrusions are dimensioned to receive an optical bench, wherein said walls define a cavity, wherein said walls retain said pins, and wherein said optical input receptacle extends from said front wall;
- a bottom cover having walls configured to receive said submount such that said submount and said bottom cover form an enclosed bottom cavity, and such that said optical input receptacle extends from said bottom cavity;
- and
- a top cover configured to be received on said submount such that said submount and said top cover form an enclosed top cavity.
An optoelectronic packaging assembly, comprising:
- a base having a bottom wall and a front wall with a protruding optical input receptacle;
- a submount attached to said bottom wall;
- and
- a heat-sink that mates with said base to form an enclosed volume, said heat-sink including a top surface with a slot;
- and
- an insert in said slot, said insert including pins that extend into said enclosed volume.
An optoelectronic packaging assembly, comprising:
- a base having a plate and a front wall with an optical input receptacle;
- a submount on said plate;
- an optical bench on said submount, said optical bench including a plurality of electrical contacts;
- a heat-sink in thermal communication with said plate;
- and
- an insert with pins that electrically connect to said plurality of electrical contacts, wherein said pins are insert molded in said insert.
An optoelectronic packaging assembly, comprising:
- a base having a plate and a front wall with an optical input receptacle;
- a submount on said plate, wherein said submount includes a liquid crystal polymer;
- an optical bench on said submount, said optical bench including a plurality of electrical contacts;
- a heat-sink in thermal communication with said plate;
- and
- an insert with pins that electrically connect to said plurality of electrical contacts.
Dependencies are inferred from the claim text.