Molded optical panel and mold therefore
AssigneesStanley Electric Co., Ltd., Sumitomo Chemical Company, Limited
InventorsShinzo Murase, Kenzo Murata
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Abstract
A photosensitive polyimide resin 12 is exposed and developed via a computer-aided designed (CAD) pattern film 14 to form a pattern onto a mold base 11 by means of photoresisit method. A molded pattern 13 is thus formed to construct a mold 10. An optical panel 2 is formed by the use of the mold 10 with an optical pattern 3 comprising circular or rectangular dot holes or dot projections each of which is several μms and arranged in high density which is a reversal of the molded pattern 13. The optical pattern 3 performs light guiding or diffusion of incident light in high luminance and with a high degree of uniformity, thereby achieving secondary illumination without having see-through of the optical pattern.
Claims30
A molded optical panel, the optical panel having at least one surface on which is integrally formed an optical pattern, said optical pattern is formed by the steps of using a mold having a mold base and forming a molded pattern on the mold base, the molded pattern being formed with a photosensitive heat resistant resin via a photoresist method with a pattern film including a high temperature baking step at the of 300° C. or higher for subjecting said photosensitive heat resin to be thermoset.
A mold for a molded optical panel for forming an optical pattern integrally at least on one surface of said optical pattern, comprising a mold base and a molded pattern, the molded pattern being formed from a photosensitive heat-resistant resin using a pattern film with a photoresist method via a high temperature baking step at the temperature of 300° C. or higher for subjecting said photosensitive heat resistant resin to be thermoset.
A method for forming an optical panel having at least one surface on which is integrally formed on an optical pattern, said method comprising the steps of:
- providing a mold having a mold base, and
- forming a molded pattern on the mold base, including forming the molded pattern with a photosensitive heat resistant resin via a photoresist method with a pattern film including a high temperature baking step at the temperature of 300° C. or higher for subjecting said photosensitive heat resistant resin to be thermoset.
Dependencies are inferred from the claim text.