Low melting point metal material injection molding method, injection molding device and body box
AssigneeSony Corporation
InventorTatsuo Yoshida
Life of this patent
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AssigneeSony Corporation
InventorTatsuo Yoshida
Estimating the term…
A concave design forming unit with the desired form is formed on the surface of a molded component for use in injection molding using a low melting point metal material. An injecting molding cavity of the predetermined shape is formed from a metal mold, and after mold curing the molten metal, the molded goods are removed from the injection molding cavity. The injection molding cavity is formed by a first metal mold unit and a second metal mold unit, the metal mold having a trapezoidal concave design forming unit with the predetermined height formed on the metal mold inside surface of the first metal mold unit or the second metal mold unit forming said injection molding cavity. The metal mold is heated to a predetermined metal mold temperature, and the molten metal heated to the predetermined molten temperature will be injected into the injection molding cavity of the heated metal mold at the predetermined injection rate. After the injected molten metal injected it is chilled and solidified, the first metal mold unit and the second metal mold unit are separated and the molded component removed from the injection molding cavity.
A metal injection molding apparatus for forming an external case for a personal computer, the external case having formed thereon a concave design pattern and being fabricated from either a metal or a metal alloy having a melting point of 650° C. or less, the metal injection molding apparatus comprising:
A metal injection molding apparatus, comprising:
A metal injection molding apparatus, comprising:
Dependencies are inferred from the claim text.