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OwnerAllen David Hertz, Eric L. Hertz +1inventors
InventorsAllen David Hertz, Eric L. Hertz, Dennis D. Epp
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A method and apparatus are disclosed for improving drying of a module, tooling, and solder stencils via the introduction of acoustic pressure waves and/or vibrational energy to the module, tooling, or solder stencils. The acoustic pressure waves may be created by a transducer where the waves are transferred to the module through air or a vibrational interface medium. The acoustic pressure waves impinge on the water droplets to atomize the droplets on the surface of the module and in the cracks, crevices and hard to reach areas of connectors and other components, without undesirable heat. The acoustic energy may further be used to assist in cleaning solder stencils within an automated screen printer.
A method for cleaning at least one of electronic assembly, stencil, and tooling related to manufacture of electronic assemblies, the steps comprising:
A method for cleaning a solder stencil, the method comprising the steps:
A method for cleaning and drying a stencil, the method comprising the steps:
Dependencies are inferred from the claim text.