Vertical wafer sawing apparatus
AssigneeSamsung Electronics Co., Ltd.
InventorsDong-Kuk Kim, Seung-Chul Ahn
Life of this patent
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Abstract
A vertical wafer sawing apparatus for separating semiconductor devices formed on a semiconductor wafer includes a chuck table disposed vertically to a supporting surface of the chuck table and a scribing member moving perpendicular to the wafer surface to dice the wafer. The chuck table or a scribing member moves in one specific direction at least among the directions of the x, y and z-axis. The direction of the x-axis runs perpendicular to a wafer stage, on which a wafer is loaded, and parallel to the ground or the support surface for the chuck table. As a result, the set-up dimensions of the apparatus can be decreased even as wafer size increases. Further, contaminants such as silicon scraps and dust on the wafer can be efficiently removed during the wafer sawing process.
Claims13
A vertical wafer sawing apparatus for singulating a wafer having a plurality of semiconductor chips formed therein and a plurality of scribe lines each formed between the adjacent chips, said apparatus comprising:
- a chuck table having a first surface for mounting the wafer having a front surface, and a second surface to which a driving member is connected, said first and second surfaces being disposed substantially vertically to a support surface for the chuck table;
- a scribing member for dicing the wafer on the scribe lines into a plurality of individual chips;
- and
- a transporting member for transferring and mounting the wafer to the chuck table, the wafer being fixedly supported relative to the chuck table by said transporting member in an upright position.
Dependencies are inferred from the claim text.