Method of fabricating a substrate with a via connection

A method of fabricating a multilayer interconnected substrate, the method comprising:

• providing a first structure comprising a first dielectric substrate having a first substantially planar surface and an opposing second substantially planar surface, a first conductive layer disposed on the first substantially planar surface of the first dielectric substrate, and a first interface between the first conductive layer and the first dielectric substrate;
• forming a plurality of blind via sites in the first structure, wherein the blind via sites extend through the dielectric substrate to the first interface between the first conductive layer and the first dielectric substrate;
• filling the blind via sites with a first conductive material by an electrolytic plating process which includes making an electrical connection to the first conductive layer;
• and
• laminating a second conductive layer to the second substantially planar surface of the first dielectric substrate and over the filled blind via sites, wherein the laminated second conductive layer is electrically connected to the filled bind via sites.

A method of fabricating a multilayer interconnected substrate, the method comprising:

• providing a structure comprising a dielectric substrate having a first substantially planar surface and an opposing second substantially planar surface, a first conductive layer on the first substantially planar surface, a second conductive layer on the second substantially planar surface, and an interface between the dielectric substrate and the second conductive layer;
• laser drilling through the first conductive layer and the dielectric substrate to the interface between the dielectric substrate and the second conductive layer to form a blind via site;
• and
• filling the blind via site with a conductive material by an electrolytic plating process which includes making an electrical connection to the second conductive layer.