Electronic surface mount package
AssigneeHalo Electronics, Inc.
InventorsPeter Lu, Jeffrey Heaton, James W. Heaton, Peter Loh Hang Pao, Robert Loke Hang Lam, Tsang Kei Sun
Life of this patent
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Abstract
An electronic surface mount package provides a one piece construction package (with an open bottom) with one or more terminal pins molded into the package. Each of the pins have a notched post upon which a wire is wound which is from a toroid transformer carried within the package. Each of the posts are notched so their respective wires are separate from one another so as to prevent arcing. The case is opened at the bottom which prevents harm from expansion or cracking.
Claims5
A method of making an electronic surface mount package, the method comprising the steps for:
- forming a package having a side wall with a bottom end;
- encapsulating a plurality of toroid transformers within the package with a resilient material;
- molding a plurality of terminal pins within the side wall, each of the pins extending through the side wall and having a solder post end, each of the post ends extending beyond the bottom end of the side wall;
- and
- wrapping and soldering the wires from the transformers to the solder post ends for each of the pins.
A method of making an electronic surface mount package, the method comprising the steps for:
- molding a one piece construction package having a side wall with a bottom end and a plurality of terminal pins within and extending from the bottom of the package;
- encapsulating and carrying a plurality of toroid transformers within the package;
- and
- wrapping and soldering the wires from the transformers to an end of a solder post for each of the pins.
Dependencies are inferred from the claim text.