Semiconductor laser device
AssigneeFurukawa Electric Co., Ltd.
InventorsMasaki Funabashi, Ryosuke Yatsu, Akihiko Kasukawa
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AssigneeFurukawa Electric Co., Ltd.
InventorsMasaki Funabashi, Ryosuke Yatsu, Akihiko Kasukawa
Estimating the term…
A DFB Laser of buried hetero type with a lasing wavelength of 1550 nm, having on an InP substrate a laminated structure of an InP buffer layer, an active layer, a 200-nm-thickness InP spacer layer, a 240-nm-period diffraction grating made of a 20-nm-thickness GaInAsP layer, and an InP first cladding layer in which diffraction grating is buried. The peak wavelength λmax of the optical gain distribution of the active layer is approximately 1530 nm. The bandgap wavelength of the diffraction grating is approximately 1510 nm. The laminated structure is etched into mesa stripes, on both sides of which are formed p/n-separated current blocking regions. Since the diffraction grating is formed of GaInAsP having λg of approximately 1510 nm, little absorption occurs at wavelengths around the lasing wavelength 1550 nm. The absorption is coefficient with respect to the peak wavelength of the optical gain distribution of the active layer is greater than the absorption coefficient with respect to the lasing wavelength.
A semiconductor laser device comprising:
A semiconductor laser device comprising:
A semiconductor laser device comprising:
A semiconductor laser device comprising:
Dependencies are inferred from the claim text.