US 6,661,690 B2 · High capacity memory module with built-in performance enhancing features

Abstract

A memory module with any combination of driver line terminators, power supply circuits, and components integral to a memory control subsystem mounted directly on the memory module for use with high speed, impedance-controlled memory buses. The memory module may be formed on a conventional printed circuit card with unpacked or packed memory chips attached directly to the memory module. Including the additional functionality directly on the memory modules improves the EMC/EMI performance as well as signal quality and integrity, thereby enhancing the memory subsystem performance. Such designs may also eliminate the need for bus exit connections, thereby allowing the freed-up connection capacity to be used to address additional memory capacity on the module. Another embodiment features a module with the additional features but without memory devices.

Claims34

Dependent claims

A self-terminating, high frequency memory module, comprising:

a) a substrate;
b) a plurality of electrical contacts disposed on at least one surface of said substrate adapted to connect to an external memory bus;
c) electrical connection means operatively connected to said plurality of electrical contacts forming an extension of said external memory bus;
d) a plurality of memory devices mounted on said substrate selectively connected to said memory bus extension;
e) bus termination means operatively connected to said memory bus extension;
and
f) a power supply circuit to provide power to said bus termination means.

4 more elements

Dependencies are inferred from the claim text.

High capacity memory module with built-in performance enhancing features

Life of this patent

High capacity memory module with built-in performance enhancing features

Life of this patent

Abstract

Claims34