Method and apparatus for removing heat from an electronic device
AssigneeSun Microsystems, Inc.
InventorsMohammed A. Tantoush, Kenneth Kitlas
Life of this patent
Estimating the term…
Abstract
The electronic device with a system for enhancing the cooling of components located therein is provided. The device includes a housing with a fan positioned adjacent the housing and adapted for producing airflow within the housing. The printed circuit board is mounted within the housing, and a heat-producing device is mounted on the printed circuit board. The heatsink is coupled to the heat-producing device, and a shroud is mounted on the printed circuit board and extends up to the heatsink so as to improve airflow in the region adjacent the heatsink.
Claims12
An apparatus for removing heat from a first device and a second device mounted on a printed circuit board, comprising:
- a first heatsink coupled to the first device;
- a second heatsink coupled to the second device;
- and
- a shroud coupled to the printed circuit board and extending up to the first heatsink and the second heatsink, the shroud having a generally polyhedron configuration with openings positioned substantially opposite one another for directing airflow through the shroud and towards the first heatsink and the second heatsink;
- wherein an edge of the first heatsink is misaligned with respect to an edge of the second heatsink and wherein an edge of the shroud that forms at least a portion of the perimeter of one of the openings is shaped to abut against the misaligned edges of the first heatsink and the second heatsink.
Dependencies are inferred from the claim text.