Dielectric structure
AssigneeShipley Company, L.L.C.
InventorsCraig S. Allen, Maria Anna Rzeznik, S. Matthew Cairns
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Abstract
Multilayer dielectric structures particularly suitable for use in capacitors and having a plating dopant in an amount sufficient to promote plating of a conductive layer are provided, together with methods of forming such structures. Such dielectric structures show increased adhesion of subsequently applied conductive layers.
Claims18
A multilayer dielectric structure having a first dielectric layer and a second dielectric layer, wherein the first dielectric layer comprises a plating dopant in an amount sufficient to promote plating of a conductive layer on the first dielectric layer.
A dielectric structure having a dielectric layer comprising a plating dopant in an amount sufficient to promote plating of a conductive layer on the dielectric layer.
A method of manufacturing a capacitor comprising the steps of depositing on a substrate a dielectric layer comprising plating dopant in an amount sufficient to promote plating of a conductive layer on the first dielectric layer, and plating a conductive layer on the surface of the dielectric layer.
A capacitor comprising a dielectric structure having a bottom dielectric layer and a top dielectric layer wherein the top dielectric layer comprises a plating dopant in an amount sufficient to promote plating of a conductive layer on the top dielectric layer, a bottom conductive layer in intimate contact with the bottom dielectric layer and a top conductive layer in intimate contact with the top dielectric layer.
Dependencies are inferred from the claim text.