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US 6,661,621 B1Granted
Compound thin film magnetic head
AssigneeRead-Rite SMI Corporation
InventorDaisuke Iitsuka
Life of this patent
Estimating the term…
Abstract
An inverse type compound thin film magnetic with good dispersion of the heat generated in the magnetoresistance (MR) element, ensuring thermal reliability. In one embodiment, an electromagnetic induction type thin film magnetic head, a magnetoresistance effect type thin film magnetic head, a first protective film, a heat dispersion layer with thermal conductivity higher than the first protective film, and a second protective film are formed in succession on a substrate.
Claims8
A compound thin film magnetic head, comprising:
- a substrate;
- an inductive type thin film magnetic head disposed over the substrate;
- a magnetoresistance effect type thin film magnetic head disposed over the inductive type thin film magnetic head;
- a first protective film disposed over the magnetoresistance effect type thin film magnetic head;
- a heat dispersion layer disposed over the first protective film, the heat dispersion layer comprising a material having a thermal conductivity higher than a thermal conductivity of the first protective film and
- a second protective film disposed over the heat dispersion layer.
3 more elements
Dependencies are inferred from the claim text.