Compact lumped element dual highpass/lowpass balun layout
AssigneeNorthrop Grumman Corporation
InventorsWilliam R. Goyette, Karl D. Peterschmidt, Trung H. Lam
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AssigneeNorthrop Grumman Corporation
InventorsWilliam R. Goyette, Karl D. Peterschmidt, Trung H. Lam
Estimating the term…
A circuit layout for a lumped element dual-balun (248) where the elements of the dual-balun (248) are patterned on a monolithic substrate (250) in a compact design. The dual-balun (248) includes four inductors (252, 254, 256, 258) and four capacitors (340, 342, 360, 388) electrically coupled together to provide two zero phase RF output signals and two 180° phase RF output signals. The inductors (252, 254, 256, 258) are symmetrically disposed in a rectangular area on the substrate (250). A first pair of the inductors (252, 254) is positioned at one end of the rectangular area, and a second pair of the inductors (256, 258) is positioned at an opposite end of the rectangular area. The capacitors (340, 342, 360, 388) are formed on the monolithic substrate (250) in a central circuit area (260) between the first pair (252, 254) and the second pair of inductors (256, 258). RF output lines (350, 354, 372, 390) are coupled to circuit elements in the circuit area (260) and extend out of the circuit area (260) between the first a pair and the second pair of the inductors (252, 254, 256, 258).
A dual-balun formed on a substrate, said dual-balun comprising:
A dual-balun for providing two zero phase RF output signals and two 180° phase RF output signals, said dual-balun comprising:
A dual-balun for providing two zero phase RF output signals and two 180° phase RF output signals for a mixer, said dual-balun comprising:
Dependencies are inferred from the claim text.