Nickel alloy probe card frame laminate
AssigneeWentworth Laboratories, Inc.
InventorsFrancis T. McQuade, Zbigniew Kukielka, William F. Thiessen, Stephen Evans
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Abstract
A probe head assembly for use in a vertical pin probing device of the type used to electrically test integrated circuit devices has a metallic spacer portion formed from a plurality of laminated metallic layers. The laminated metallic layers are formed from a low coefficient of thermal expansion metal, such as Invar, a 36% nickel—64% iron alloy. By orienting the metallic grains of the laminated metal layers to be off-set from the orientation of metallic grains of adjacent metallic foil layers, increased strength and flatness is achieved.
Claims15
A probe head assembly suitable for use in a vertical pin probing device, comprising:
- a first spacer member having a first innermost surface and a first outermost surface and a centrally disposed first aperture, a first dielectric sheet spanning said first aperture adjacent said first outermost surface, said first dielectric sheet having a first set of through-holes defining a pattern;
- a second spacer member having a second innermost surface and a second outermost surface and a centrally disposed second aperture, a second dielectric sheet that is substantially parallel to said first dielectric sheet spanning said second aperture adjacent said second outermost surface, said second dielectric sheet having a second set of through holes defining said same pattern but horizontally off-set from vertical alignment with said first set of through holes, wherein said second innermost surface is adjacent said first innermost surface;
- and
- at least one of said first spacer member and said second spacer member being a composite formed of a plurality of lamination layers of a low coefficient of thermal expansion metal alloy foil laminated together wherein at least a first lamination layer and a second lamination layer have non-aligned elongated metallic grains.
Dependencies are inferred from the claim text.