Temperature compensated crystal oscillator and method of manufacturing the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorHyung Kon Kim
Life of this patent
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Abstract
A temperature compensated crystal oscillator is manufactured by placing a ring-shaped board on a main board to surround compensating components on the main board, and placing a crystal package on the ring-shaped board. A component mounting area on the main board is reduced, thereby reducing a product size. At least one conductive pad may be attached to the ring-shaped board to connect the crystal package to a certain circuit on the main board. The conductive pad may be provided at each of four corners of a rectangular ring-shaped board.
Claims17
A temperature compensated crystal oscillator including a crystal package and at least one component for compensating frequency variation of the crystal package due to temperature variation, the crystal oscillator further comprising;
- a ring-shaped board disposed under the crystal package and comprising a frame structure having an inner space, the inner space being at least as large as a space required to accommodate the temperature compensating component:
- and
- a main board disposed under the ring-shaped board and on which the temperature compensating component is mounted within an area corresponding to the inner space of the ring-shaped board.
The temperature compensated crystal oscillator as set forth in claim, 5, wherein the ring-shaped board has a rectangular structure, and the conductive pad is positioned at each of four corners of the ring-shaped board.
A method of manufacturing a temperature compensated crystal oscillator including a crystal package and at least one component for compensating frequency variation of the crystal package due to temperature variation, the method comprising the steps of:
- preparing a main board having an upper surface including an area required for mounting of the temperature compensating component placing the temperature compensating component on the component mounting area of the main board:
- placing a ring-shaped board on, the main board, the ring-shaped board having an inner space at least as large as the component mounting area;
- and
- placing the crystal package on the ring-shaped board.
The method as set forth in clam 7, wherein the main board has the same area as that of the crystal package.
Dependencies are inferred from the claim text.