Microelectronic assembly with pre-disposed fill material and associated method of manufacture

A microelectronic substrate assembly formed by a method, comprising:

• disposing a quantity of fill material in a cavity defined by a surface of the microelectronic substrate and a bond member projecting away from the surface of the microelectronic substrate before engaging the fill material with a support member, wherein the bond member includes a solder ball having a diameter of about 150 microns and a bonding surface facing away from the microelectronic substrate, and wherein disposing the fill material includes disposing the fill material to a thickness of about 25 microns or less beyond the bonding surface of solder balls.

A microelectronic substrate assembly for mounting to a support member, comprising:

• a microelectronic substrate having a first surface and a plurality of second surfaces extending away from the first surface, a third surface facing in a direction opposite the first surface, and at least one bond member extending away from the substrate surface to define a fill region on the substrate surface, the bond member being configured to be bonded to the support member;
• and
• a volume of uncured fill material disposed in the fill region and having a first surface attached to at least the substrate surface, the fill material having a second surface exposed before attaching the microelectronic substrate to the support member wherein the fill material engages a portion of the second surfaces extending from the first surface to a point from about 60% to about 70% of the distance from the first surface to the third surface of the microelectronic substrate.

A microelectronic substrate assembly for mounting to a support member, comprising:

• a microelectronic substrate having a substrate surface and at least one bond member extending away from the substrate surface to define a fill region on the substrate surface, the bond member being configured to be bonded to the support member, wherein the bond member includes a solder ball having a diameter of about 150 microns and a bonding surface facing away from the microelectronic substrate;
• a volume of uncured fill material disposed in the fill region and having a first surface attached to at least the substrate surface, the fill material having a second surface exposed before attaching the microelectronic substrate to the support member, wherein the fill material has a thickness of about 25 microns or less beyond the bonding surface of the solder ball.

A microelectronic substrate assembly for mounting to a support member, comprising:

• a microelectronic substrate having a substrate surface and at least one bond member extending away from the substrate surface to define a fill region on the substrate surface, the bond member being configured to be bonded to the support member;
• and
• a volume of uncured fill material disposed in the fill region and having a first surface attached to at least the substrate surface, the fill material having a second surface exposed before attaching the microelectronic substrate to the support member, wherein the fill material has a thixotropic index of from about four to about six.

A microelectronic substrate assembly for mounting to a support member, comprising:

• a microelectronic substrate having a substrate surface and at least one bond member extending away from the substrate surface to define a fill region on the substrate surface, the bond member being configured to be bonded to the support member;
• and
• a volume of uncured fill material disposed in the fill region and having a first surface attached to at least the substrate surface, the fill material having a second surface exposed before attaching the microelectronic substrate to the support member, wherein the fill material has a thixotropic index of about five.

A microelectronic substrate assembly for mounting to a support member, comprising:

• a microelectronic substrate having a substrate surface and at least one bond member extending away from the substrate surface to define a fill region on the substrate surface, the bond member being configured to be bonded to the support member;
• and
• a volume of uncured fill material disposed in the fill region and having a first surface attached to at least the substrate surface, the fill material having a second surface exposed before attaching the microelectronic substrate to the support member, wherein the fill material includes an uncured epoxy.