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US 6,661,103 B2Granted
Apparatus for packaging flip chip bare die on printed circuit boards
AssigneeMicron Technology, Inc.
InventorSalman Akram
Life of this patent
Estimating the term…
Abstract
An apparatus and a method for providing a fully protective package for a flip chip with a protective shield plate and an underfill encapsulant material. The apparatus comprises a semiconductor chip electrically connected by flip chip attachment to a substrate. A shield plate is placed in contact with a back surface of the semiconductor chip. An underfill encapsulant is disposed between the semiconductor chip and the shield plate, and the substrate. A glob top encapsulant may be applied about the periphery of the upper surface of the shield plate that extends to the substrate for additional protection and/or adherence.
Claims40
A semiconductor assembly comprising:
- a semiconductor chip mounted on a substrate, said semiconductor chip having a first surface connected to a portion of said substrate and having a second surface;
- a shield plate having a first surface contacting said second surface of said semiconductor chip and having a second surface;
- an underfill encapsulant located between said first surface of said semiconductor chip and said first surface of said shield plate and said substrate;
- and
- glob top material disposed on substantially a periphery of said second surface of said shield plate, said glob top material extending for contact with said substrate.
2 more elements
A semiconductor assembly comprising:
- a semiconductor chip mounted on a substrate, said semiconductor chip having a first surface attached to a portion of said substrate and having a second surface;
- a shield plate having a first surface contacting at least a portion of said second surface of said semiconductor chip and having a second surface;
- an underfill encapsulant disposed between said first surface of said semiconductor chip and said first surface of said shield plate and said substrate;
- and
- a glob top material disposed on a periphery of said second surface of said shield plate extending to contact said substrate.
2 more elements
A semiconductor assembly comprising:
- a semiconductor chip mounted on a substrate, said semiconductor chip having a first surface connected to a portion of said substrate and having a second surface;
- a shield plate having a first surface contacting a portion of said second surface of said semiconductor chip and having a second surface;
- an underfill encapsulant disposed between said first surface of said semiconductor chip and said first surface of said shield plate and said substrate;
- and
- a glob top material disposed on a periphery of said second surface of said shield plate for extending to contact a portion of said substrate.
2 more elements
An assembly comprising:
- a flip-chip mounted on a substrate, said flip-chip having a first surface connected to a portion of said substrate and having a second surface;
- a shield plate having a first surface contacting said second surface of said flip-chip and having a second surface;
- an underfill encapsulant located between said first surface of said flip-chip and said first surface of said shield plate and said substrate;
- and
- glob top material disposed on substantially a periphery of said second surface of said shield plate, said glob top material extending for contact with said substrate.
2 more elements
An assembly comprising:
- a flip-chip mounted on a substrate, said flip-chip having a first surface attached to a portion of said substrate and having a second surface;
- a shield plate having a first surface contacting at least a portion of said second surface of said flip-chip and having a second surface;
- an underfill encapsulant disposed between said first surface of said flip-chip and said first surface of said shield plate and said substrate;
- and
- a glob top material disposed on a periphery of said second surface of said shield plate extending to contact said substrate.
2 more elements
An assembly comprising:
- a flip-chip mounted on a substrate, said flip-chip having a first surface connected to a portion of said substrate and having a second surface;
- a shield plate having a first surface contacting a portion of said second surface of said flip-chip and having a second surface;
- an underfill encapsulant disposed between said first surface of said flip-chip and said first surface of said shield plate and said substrate;
- and
- a glob top material disposed on a periphery of said second surface of said shield plate for extending to contact a portion of said substrate.
2 more elements
An assembly comprising:
- a flip-chip mounted on a substrate, said flip-chip having a portion of an active surface thereof connected to a portion of said substrate and having a second surface;
- a shield plate having a first surface contacting said second surface of said flip-chip and having a second surface;
- an underfill encapsulant located between said active surface of said flip-chip and said first surface of said shield plate and said substrate;
- and
- glob top material disposed on substantially a periphery of said second surface of said shield plate, said glob top material extending for contact with said substrate.
2 more elements
An assembly comprising:
- a flip-chip mounted on a substrate, said flip-chip having a portion of an active surface thereof attached to a portion of said substrate and having a second surface;
- a shield plate having a first surface contacting at least a portion of said second surface of said flip-chip and having a second surface;
- an underfill encapsulant disposed between a portion of said active surface of said flip-chip and said first surface of said shield plate and said substrate;
- and
- a glob top material disposed on a periphery of said second surface of said shield plate extending to contact said substrate.
2 more elements
An assembly comprising:
- a flip-chip mounted on a substrate, said flip-chip having a portion of an active surface thereof connected to a portion of said substrate and having a second surface;
- a shield plate having a first surface contacting a portion of said second surface of said flip-chip and having a second surface;
- an underfill encapsulant disposed between a portion of said active surface of said flip-chip and said first surface of said shield plate and said substrate;
- and
- a glob top material disposed on a periphery of said second surface of said shield plate for extending to contact a portion of said substrate.
2 more elements
An assembly comprising:
- a flip-chip mounted on a substrate, said flip-chip having a portion of a face surface thereof connected to a portion of said substrate and having a second surface;
- a shield plate having a first surface contacting said second surface of said flip-chip and having a second surface;
- an underfill encapsulant located between said face surface of said flip-chip and said first surface of said shield plate and said substrate;
- and
- glob top material disposed on substantially a periphery of said second surface of said shield plate, said glob top material extending for contact with said substrate.
2 more elements
An assembly comprising:
- a flip-chip mounted on a substrate, said flip-chip having a portion of a face surface thereof attached to a portion of said substrate and having a second surface;
- a shield plate having a first surface contacting at least a portion of said second surface of said flip-chip and having a second surface;
- an underfill encapsulant disposed between a portion of said face surface of said flip-chip and said first surface of said shield plate and said substrate;
- and
- a glob top material disposed on a periphery of said second surface of said shield plate extending to contact said substrate.
2 more elements
An assembly comprising:
- a flip-chip mounted on a substrate, said flip-chip having a portion of a face surface thereof connected to a portion of said substrate and having a second surface;
- a shield plate having a first surface contacting a portion of said second surface of said flip-chip and having a second surface;
- an underfill encapsulant disposed between a portion of said face surface of said flip-chip and said first surface of said shield plate and said substrate;
- and
- a glob top material disposed on a periphery of said second surface of said shield plate for extending to contact a portion of said substrate.
2 more elements
Dependencies are inferred from the claim text.