High density area array solder microjoining interconnect structure and fabrication method

A system for connecting a set of device chips by means of an array of microjoint structures on an interconnect carrier comprising:

• a carrier including a multilayer substrate having a plurality of microjoint receptacles in one surface;
• a set of microjoint pads, including solder balls, on the device chips joined to the receptacles in the one carrier surface;
• and
• an interconnect wiring mounted in the carrier connecting to the microjoint pad arrays to enable the interconnection between device chips mounted on the carrier;
• wherein said receptacles on said interconnect carrier comprise successive layers of a liner layer, seed layer, barrier layer and a noble metal layer, respectively, these layers lining the inner surface of said receptacles.