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US 6,661,091 B1Granted
Semiconductor device
AssigneeMitsubishi Denki Kabushiki Kaisha
InventorKoji Bando
Life of this patent
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Abstract
A semiconductor device comprises a die pad having an opening, a semiconductor chip located in the opening and another semiconductor chip. The semiconductor chip has a terminal surface and a non-terminal surface positioned opposite to the terminal surface. The semiconductor chip has a non-terminal surface facing the non-terminal surface and the die pad and a terminal surface positioned opposite to the non-terminal surface. Thus provided is a semiconductor device having a high degree of freedom in design mounted with semiconductor chips in high density.
Claims8
A semiconductor device comprising:
- a die pad having an opening;
- a first semiconductor chip, having a first surface forming a terminal surface and a second surface positioned opposite to said first surface, located in said opening;
- and
- a second semiconductor chip having a third surface facing said second surface and said die pad and a fourth surface, positioned opposite to said third surface, forming a terminal surface.
1 more element
Dependencies are inferred from the claim text.