Semiconductor integrated circuit device having interposer and method of manufacturing the same

A semiconductor integrated circuit device having a circuit device which realizes a function, comprising:

• a semiconductor chip having a plurality of first pads arranged at first pitches on a surface thereof, said semiconductor chip being unable to unilaterally realize the function;
• an interposer having a first surface and a second surface, said first surface having a plurality of second pads arranged at the first pitches thereon and said second surface having a plurality of third pads arranged at second pitches which are larger than the first pitches, said interposer being unable to unilaterally realize the function;
• and
• a substrate having a plurality of fourth pads arranged at the second pitches on a surface thereof,
• wherein the second pads and the first pads are connected to each other by joining the first surface of the interposer to the surface of the semiconductor chip so as to face each other, thereby realizing the function;
• and
• the fourth pads and the third pads are connected to each other by joining the surface of the substrate to the second surface of the interposer so as to face each other.