Lead frame and flip chip semiconductor package with the same

A flip chip semiconductor package, comprising:

• a lead frame having a die pad and a plurality of leads surrounding the die pad, wherein the leads are made in a punching manner to be lower in elevation than the die pad so as to form a height difference between the die pad and the leads, and wherein the height difference is determined according to collapse degree of a plurality of conductive elements and corresponds to a collapsed height of the conductive elements, which electrically connect a semiconductor chip to the leads;
• at least one semiconductor chip mounted on the lead frame in a flip-chip manner so that an active surface of the semiconductor chip is attached to the die pad and electrically connected to the leads by the conductive elements interposed between the active surface and the leads, wherein the conductive elements have a collapsed height corresponding to the height difference between the die pad and the leads and are received between the semiconductor chip and the leads;
• and
• an encapsulant for encapsulating the semiconductor chip and the conductive elements on the lead frame.

A flip chip semiconductor package, comprising:

• a lead frame having a die pad and a plurality of leads surrounding the die pad, each of the leads having an inner end directed toward the die pad, wherein the inner end of each of the leads is formed with a recessed contact portion, making the die pad higher in elevation than the leads by a height difference corresponding to a depth of the recessed contact portions of the leads, and wherein the depth of the recessed contact portions is determined according to collapse degree of a plurality of conductive elements and corresponds to a collapsed height of the conductive elements, which electrically connect a semiconductor chip to the leads;
• at least one semiconductor chip mounted on the lead frame in a flip-chip manner so that an active surface of the semiconductor chip is attached to the die pad and electrically connected to the leads by the conductive elements interposed between the active surface and the leads, wherein the conductive elements have a collapsed height corresponding to the depth of the recessed contact portions of the leads and are received within the recessed contact portions;
• and
• an encapsulant for encapsulating the semiconductor chip and the conductive elements on the lead frame.