Three-dimensionally embodied circuit with electrically connected semiconductor chips

A three-dimensionally embodied circuit, comprising:

• a plurality of semiconductor chips configured one above another, said plurality of said semiconductor chips including a first semiconductor chip, said first semiconductor chip having a conductivity type, an active first surface, a second surface opposite said active first surface, interconnects running from said active first surface to said second surface, and other zones;
• and
• contact plugs electrically connecting said plurality of said semiconductor chips together;
• said first semiconductor chip including regions surrounding said interconnects, said regions having a conductivity type opposing said conductivity type of said first semiconductor chip;
• said regions cooperating with said interconnects such that each one of said interconnects is electrically insulated from said other zones of said first semiconductor chip by a pn junction;
• and
• said regions formed by a thermomigration of a conductive material.