Micromechanical and microoptomechanical structures with single crystal silicon exposure step
AssigneesMicroscan Systems, Inc., Xerox Corporation
InventorsAndrew J. Zosel, Joel A. Kubby, Peter M. Gulvin, Chuang-Chia Lin, Jingkuang Chen, Alex T. Tran
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Abstract
The present invention provides a micromechanical or microoptomechanical structure. The structure is produced by a process comprising defining a structure on a single crystal silicon layer separated by an insulator layer from a substrate layer; depositing and etching a polysilicon layer on the single crystal silicon layer, with remaining polysilcon forming mechanical or optical elements of the structure; exposing a selected area of the single crystal silicon layer; and releasing the formed structure.
Claims11
A micromechanical or microoptomechanical structure produced by a process comprising:
- defining a structure on a single crystal silicon layer separated by an insulator layer from a substrate layer;
- depositing and etching a polysilicon layer on the single crystal silicon layer, with remaining polysilcon forming mechanical or optical elements of the structure;
- exposing a selected area of the single crystal silicon layer;
- and
- releasing the formed structure.
Dependencies are inferred from the claim text.