Pin standing resin-made substrate, method of making pin standing resin-made substrate, pin and method of making pin
AssigneeNgk Spark Plug Co., Ltd.
InventorsHajime Saiki, Noritaka Miyamoto
Life of this patent
Estimating the term…
Abstract
A pin standing resin substrate comprises: a resin substrate having a substantially plate-shaped main surface and comprising one of a resin and a composite material containing a resin, with a pin-pad exposed from the main surface; and a pin solder-jointed to the pin-pad, wherein the pin has been subjected to thermal treatment so as to soften the pin, and comprises a rod-like portion and an enlarged diameter portion having the same material as the rod-like portion, the enlarged diameter portion having a larger diameter than the rod-like portion and being formed at one end of the rod-like portion, and at least the enlarged diameter portion is soldered to the pin-pad.
Claims31
A pin standing resin substrate comprising:
- a resin substrate having a substantially plate-shaped main surface and comprising one of a resin and a composite material containing a resin, with a pin-pad exposed from the main surface;
- and
- a pin subjected to thermal treatment so as to soften the pin, and including a rod-like portion and an enlarged diameter portion having the same material as the rod-like portion, the enlarged diameter portion having, a larger diameter than the rod-like portion and being formed at one end of the rod-like portion, the enlarged diameter portion including a side facing the pin-pad and made of the same material as the enlarged diameter portion;
- and
- a solder contacting the pin-pad and the side of the enlarged diameter portion facing the pin-pad and defining a single solder joint between the pin and the pin-pad.
A method of making a pin standing resin substrate, which comprises:
- a pin thermal treatment step of subjecting a pin to thermal treatment by heating so as to soften the pin, wherein the pin comprises a rod-like portion and an enlarged diameter portion having the same material as the rod-like portion, the enlarged diameter portion having a larger diameter than the rod-like portion and being formed at one end of the rod-like portion, the enlarged diameter portion including a side opposite to the rod-like portion and facing away from the rod-like portion, the side having the same material as the enlarged diameter portion;
- and
- a pin fixing step of soldering a pin-pad with at least the side of the enlarged diameter portion of the pin, so as to fix the pin with a resin substrate, wherein the resin substrate has a substantially plate-shaped main surface and comprises one of a resin and a composite material containing a resin, with the pin-pad exposed from the main surface.
The method of making a pin standing resin substrate, which comprises:
- a pin hardness reducing step of reducing the Vickers hardness (Hv) of a pin to 200 or less, wherein the pin comprises a rod-like portion and an enlarged diameter portion having the same material comprising one of kovar and 42 alloy, the enlarged diameter portion having a larger diameter than the rod-like portion and being formed at one end of the rod-like portion;
- and
- a pin fixing step of soldering a pin-pad with at least the enlarged diameter portion of the pin, so as to fix the pin with a resin substrate, wherein the resin substrate has a substantially plate-shaped main surface and comprises one of a resin and a composite material containing a resin, with the pin-pad exposed from the main surface.
A method of making a pin standing resin substrate, which comprises:
- a pin fixing step of soldering a pin-pad with at least an enlarged diameter portion of a pin, so as to fix the pin to a resin substrate,
- wherein the resin substrate has a substantially plate-shaped main surface and comprises one of a resin and a composite material containing a resin, with the pin-pad exposed from the main surface, the pin has a Vickers hardness (Hv) of 200 or less, and the pin comprises a rod-like portion and an enlarged diameter portion having the same material comprising one of kovar and 42 alloy, the enlarged diameter portion having a larger diameter than the rod-like portion and being formed at one end of the rod-like portion.
A pin for use in a pin standing substrate having at least one pin as an input/output terminal standing thereon, which comprises:
- a rod-like portion;
- and
- an enlarged diameter portion having the same material as the rod-like portion, with a larger diameter than the rod-like portion and formed at one end of the rod-like portion,
- wherein the pin is subjected to thermal treatment by heating so that a Vickers hardness of the rod-like portion and the enlarged diameter portion is reduced to 200 or less.
A method of making a pin for use in a pin standing substrate having at least one pin as an input/output terminal standing thereon, which comprises:
- a thermal treatment step of making thermal treatment by heating so as to reduce a Vickers hardness of the rod-like portion and the enlarged diameter portion to 200 or less,
- wherein the pin comprises a rod-like portion and an enlarged diameter portion having the same material as the rod-like portion, with a larger diameter than the rod-like portion and formed at one end of the rod-like portion.
A pin standing resin substrate comprising:
- a resin substrate having a substantially plate-shaped main surface and comprising one of a resin and a composite material containing a resin, with a pin-pad exposed from the main surface;
- and
- a pin including a rod-like portion and an enlarged diameter portion having the same material as the rod-like portion, the enlarged diameter portion having a larger diameter than the rod-like portion and being formed at one end of the rod-like portion, the enlarged diameter portion including a side facing the pin-pad and made of the same material as the enlarged diameter portion;
- and
- a solder contacting the pin-pad and the side of the enlarged diameter portion facing the pin-pad and defining a single solder joint between the pin and the pin-pad,
- wherein the rod-like portion and the enlarged diameter portion comprise one of kovar and 42 alloy, and the pin has a Vickers hardness Hv of 200 or less.
Dependencies are inferred from the claim text.