Semiconductor device with an exposed external-connection terminal
AssigneeShinko Electric Industries Co., Ltd.
InventorsMichio Horiuchi, Takashi Kurihara
Life of this patent
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Abstract
A wiring substrate equipped with a rerouted wiring having one end connected to an electronic-part mounting pad for electrically connecting an electronic part and another end connected to an external-connection terminal. In the wiring substrate, a low-elasticity underlayer made of a material having a lower modulus of elasticity than that of a base material of the wiring substrate is disposed between the base material of the wiring substrate and each of the electronic-part mounting pad and the rerouted wiring. A method of manufacturing the wiring substrate and a semiconductor device using the wiring substrate are also disclosed.
Claims18
A wiring substrate equipped with a rerouted wiring having one end connected to an electronic-part mounting pod for electrically connecting an electronic part and another end connected to an external-connection terminal, in which said wiring substrate comprises a base body having selectively formed thereon a low-elasticity underlayer, made of a material having a lower modulus of elasticity than that of the base body, in a pattern that the external-connection terminal is exposed in a surface of the base body, said underlayer being positioned between the base body of the wiring substrate and each of the electronic-part mounting pad and the rerouted wiring.
A semiconductor device comprising a wiring substrate equipped with a rerouted wiring having one end connecting an electronic-part mounting pad for electrically connected an electronic part and another end connected to an external-connection terminal, and an electronic part electrically connected and mounted on the pad of the wiring substrate, in which said wiring substrate comprises a base body having selectively formed thereon a low-elasticity underlayer, made of a material having a lower modulus of elasticity than that of the base body, in a pattern that the external-connection terminal is exposed in a surface of the base body, said underlayer being positioned between the base body of the wiring substrate and each of the electronic-part mounting pad and the rerouted wiring.
A method of manufacturing a wiring substrate according to which comprises the steps of:
- forming a low-elasticity underlayer from a material having a Young's modulus of less than 1 GPa measured at a room temperature (20 to 30° C.) and a Young's modulus of 10 MPa or less measured at 150° C., on the base material of the wiring substrate;
- forming a through-hole that extends from the upper surface of the low-elasticity underlayer to the rerouted wiring on the base material located at the lower surface of the low-elasticity underlayer, at a predetermined position of the low-elasticity underlayer;
- and
- forming, by plating, a connection via-hole in the through-hole, the electronic-part mounting pad, and the rerouted wiring.
Dependencies are inferred from the claim text.