Epoxy resin composition and curing product thereof
AssigneeDainippon Ink and Chemicals, Inc.
InventorsIchiro Ogura, Yoshiyuki Takahashi
Life of this patent
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Abstract
An epoxy resin composition comprising: (i) an epoxy resin having a melt viscosity of from 0.1 dPa to 5 dPa at 150° C. and having two or more repeating units each comprising: a methylene bond substituted by at least an aromatic ring; and a benzene ring substituted by at least a glycidyloxy group, wherein said aromatic ring is at least one member selected from the group consisting of (a) condensed aromatic rings and (b) combinations of aromatic rings in which two or more aromatic monocycles or condensed aromatic rings are connected directly to each other via a single bond; and (ii) a curing agent.
Claims7
An epoxy resin composition comprising:
- (i) an epoxy resin having a melt viscosity of from 0.1 dPa to 5 dPa at 1 500° C. and having two or more repeating units each comprising:
- a methylene group substituted by at least an aromatic ring;
- and
- a benzene ring substituted by at least a glycidyloxy group,
- wherein said aromatic ring is a combination of aromatic rings in which two or more aromatic monocycles or condensed aromatic rings are connected directly to each other via a single bond;
- and
- (ii) a curing agent.
Dependencies are inferred from the claim text.