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US 6,660,807 B2Granted
Additive for organic resin and organic resin composition
AssigneeDow Corning Toray Silcone Co., Ltd.
InventorsYoshitsugu Morita, Haruhiko Furukawa, Koji Shiromoto, Hiroshi Ueki
Life of this patent
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Abstract
An additive for organic resin comprising a powder comprising (A) a liquid organopolysiloxane having at least 0.001 wt % of silicon-bonded hydrogen atoms and at least 50 dimethylsiloxy repeating units and (B) an inorganic powder; and an organic resin comprising the additive.
Claims7
An organic resin composition comprising;
- (I) a thermoplastic organic resin selected from the group consisting of polyolefin, polyester, polystyrene, polyacrylic, and polyvinylchloride resins and (II) an additive for organic resin consisting essentially of 100 parts by weight of (A) a liquid organopolysiloxane having at least 0.001 wt % of silicon-bonded hydrogen atoms and at least 50 dimethylsiloxy repeating units and 50 to 250 parts by weight of a (B) metal oxide, wherein said additive is a powder having an average particle size of 0.1 to 500 μm.
Dependencies are inferred from the claim text.