Method and apparatus for growing layer on one surface of wafer
AssigneeWindbond Electronics Corp.
InventorsMing-Kwei Lee, Hsin-Chih Liao
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Abstract
A method and an apparatus for growing a layer on one surface of a wafer by liquid phase deposition are provided. At first, a first wafer is putted on a first wafer-holder by its first surface. Then, a growth-liquid vessel having a first opening at the bottom is mounted on the first wafer-holder. Thereafter, a growth liquid is poured into the growth-liquid vessel to expose a second surface of the first wafer to the growth liquid for growing the layer on the second surface of the first wafer. Then, the, first wafer is taken out from the first wafer-holder to obtain a wafer with a layer grown only on one surface.
Claims12
A method of growing a layer on one surface of a wafer by liquid phase deposition, said method comprising the steps of:
- putting a first wafer on a first wafer-holder by a first surface of said first wafer;
- providing a growth-liquid vessel having a first opening at the bottom thereof;
- mounting said first opening of said growth-liquid vessel on said first wafer-holder;
- pouring a growth liquid into said growth-liquid vessel to expose a second surface of said first wafer to said growth liquid for growing said layer on said second surface of said first wafer;
- and
- taking out said first wafer;
- wherein said method further comprises the steps of:
- putting a second wafer on a second wafer-holder by a first surface of said second wafer;
- and
- after said pouring step, mounting said second wafer-holder on a second opening at the top of said growth-liquid vessel.
A method of growing a layer on one surface of a wafer by liquid phase deposition, said method comprising the steps of:
- providing a number of wafers each having opposite first and second surfaces;
- putting a first plurality of said wafers on a first wafer-holder by the first surfaces of said first wafers;
- providing a plurality of growth-liquid vessels, each of which has first and second openings at opposite ends thereof;
- mounting said first openings of said growth-liquid vessels on said first wafer-holder with each of said first wafers on said first wafer-holder corresponding to one of said growth-liquid vessels;
- pouring a growth liquid into said growth-liquid vessels to expose the second surfaces of said first wafers to said growth liquid for growing said layer on said second surface of each of said first wafers;
- putting a second plurality of said wafers on a second wafer-holder by the first surfaces of said second wafers;
- mounting said second wafer-holder on the second openings of said growth-liquid vessels with each of said second wafers on said second wafer-holder corresponding to one of said growth-liquid vessels;
- inverting said growth-liquid vessels to place said first openings at the top thereof and said second openings at the bottom thereof and to expose the second surfaces of said second wafers to said growth liquid for growing said layer on said second surface of each of said second wafers;
- removing said first wafer-holder from said first openings of said growth-liquid vessels;
- and
- removing said first wafers from said first wafer-holder.
Dependencies are inferred from the claim text.