Thin film semiconductor device and method for producing the same

A process for depositing a thin film over a substrate by plasma-enhanced chemical vapor deposition (PECVD), the process comprising:

• a first step of loading the substrate in a reaction chamber;
• a second step, performed after loading of said substrate, of maintaining the reaction chamber at a first pressure and a first preheating of said substrate then;
• a third step of a second preheating of said substrate;
• and then
• a fourth step of depositing the thin film over the substrate at a second pressure lower than the first pressure, conditions in the reaction chamber being equivalent during the third and the fourth steps with the exception of a plasma introduced into the reaction chamber during the fourth step.

A process for depositing a thin film over a substrate by plasma-enhanced chemical vapor deposition (PECVD), the process comprising:

• a first step of loading the substrate in a reaction chamber;
• a second step, performed after loading of said substrate, of introducing gases into said reaction chamber at a first pressure and a first preheating of said substrate then;
• a third step of a second preheating of said substrate;
• and then
• a fourth step of depositing the thin film over the substrate at a second pressure lower than the first pressure, said gases introduced into the reaction chamber in the second step having a higher thermal conductivity than gases introduced into the reaction chamber during the fourth step, and conditions in the reaction chamber being equivalent during the third and the fourth steps with the exception of a plasma introduced into the reaction chamber during the fourth step.

A process for producing a display, comprising:

• a step of forming an active matrix substrate by depositing a thin film over a substrate by plasma-enhanced chemical vapor deposition (PECVD), the step of forming the active matrix comprising:
• a first step of loading a substrate in a reaction chamber;
• a second step, performed after loading, of introducing gases into said reaction chamber, and a first preheating of said substrate then;
• a third step of a second preheating and
• a fourth step of depositing the thin film over the substrate, said gases introduced into the reaction chamber in the second step having a higher thermal conductivity than gases introduced into the reaction chamber during the fourth step, and conditions in the reaction chamber being equivalent during the third and the fourth steps with the exception of a plasma introduced into the reaction chamber during the fourth step;
• and
• a step of forming a panel using the active matrix substrate.

A process for producing a display, comprising:

• a step of forming an active matrix substrate by depositing a thin film over a substrate by plasma-enhanced chemical vapor deposition (PECVD), the step of forming the active matrix comprising:
• a first step of loading the substrate in a reaction chamber;
• a second step, performed after loading of said substrate, of maintaining the reaction chamber at a first pressure and a first preheating of said substrate then;
• a third step of a second preheating of said substrate;
• and then
• a fourth step of depositing the thin film over the substrate at a second pressure lower than the first pressure, conditions in the reaction chamber being equivalent during the third and the fourth steps with the exception of a plasma introduced into the reaction chamber during the fourth step;
• and
• a step of forming a panel using the active matrix substrate.

A process for producing a display, comprising:

• a step of forming an active matrix substrate by depositing a thin film over a substrate by plasma-enhanced chemical vapor deposition (PECVD), the step of forming the active matrix comprising:
• a first step of loading the substrate in a reaction chamber;
• a second step, performed after loading of said substrate, of introducing gases into said reaction chamber at a first pressure and a first preheating of said substrate then;
• a third step of a second preheating of said substrate;
• and then
• a fourth step of depositing the thin film over the substrate at a second pressure lower than the first pressure, said gases introduced into the reaction chamber in the second step having a higher thermal conductivity than gases introduced into the reaction chamber during the fourth step, and conditions in the reaction chamber being equivalent during the third and the fourth steps with the exception of a plasma introduced into the reaction chamber during the fourth step;
• and
• a step of forming a panel using the active matrix substrate.

A process for producing an electronic device, comprising:

• a step of forming an active matrix substrate by depositing a thin film over a substrate by plasma-enhanced chemical vapor deposition (PECVD), the step of forming the active matrix comprising:
• a first step of loading a substrate in a reaction chamber;
• a second step, performed after loading of said substrate, of introducing gases into said reaction chamber, and a first preheating of said substrate then;
• a third step of a second preheating of said substrate;
• and then and
• a fourth step of depositing the thin film over the substrate, said gases introduced into the reaction chamber in the second step having a higher thermal conductivity than gases introduced into the reaction chamber during the fourth step, and conditions in the reaction chamber being equivalent during the third and the fourth steps with the exception of a plasma introduced into the reaction chamber during the fourth step;
• a step of forming a panel using the active matrix substrate;
• and
• a step of installing the panel in a body constituting the electronic device.

A process for producing an electronic device, comprising:

• a step of forming an active matrix substrate by depositing a thin film over a substrate by plasma-enhanced chemical vapor deposition (PECVD), the step of forming the active matrix comprising:
• a first step of loading the substrate in a reaction chamber;
• a second step, performed after loading of said substrate, of maintaining the reaction chamber at a first pressure and a first preheating of said substrate then;
• a third step of a second preheating of said substrate;
• and then
• a fourth step of depositing the thin film over the substrate at a second pressure lower than the first pressure, conditions in the reaction chamber being equivalent during the third and the fourth steps with the exception of a plasma introduced into the reaction chamber during the fourth step;
• a step of forming a panel using the active matrix substrate;
• and
• a step of installing the panel in a body constituting the electronic device.

A process for producing an electronic device, comprising:

• a step of forming an active matrix substrate by depositing a thin film over a substrate by plasma-enhanced chemical vapor deposition (PECVD), the step of forming the active matrix comprising:
• a first step of loading the substrate in a reaction chamber;
• a second step, performed after loading of said substrate, of introducing gases into said reaction chamber at a first pressure and a first preheating of said substrate then;
• a third step of a second preheating of said substrate;
• and then
• a fourth step of depositing the thin film over the substrate at a second pressure lower than the first pressure, said gases introduced into the reaction chamber in the second step having a higher thermal conductivity than gases introduced into the reaction chamber during the fourth step, and conditions in the reaction chamber being equivalent during the third and the fourth steps with the exception of a plasma introduced into the reaction chamber during the fourth step;
• a step of forming a panel using the active matrix substrate;
• and
• a step of installing the panel in a body constituting the electronic device.