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US 6,660,565 B1Granted
Flip chip molded/exposed die process and package structure
AssigneeSt Assembly Test Services Pte Ltd
InventorJohn Briar
Life of this patent
Estimating the term…
Abstract
In accordance with the objectives of the invention a new method is provided to insert the underfill for flip-chip semiconductor devices. An IC chip is provided with solder bumps. The flip-chip is entered into an enclosed space, the heatsink forms the top of the enclosed space, the substrate forms the bottom of the enclosed space. The enclosed space is filled with a mold compound. This mold compound now surrounds the IC chip thereby including the area below the IC. The step of inserting the underfill as a separate processing step has thereby been eliminated.
Claims12
A method of packaging Integrated Circuit devices, comprising:
- providing an Integrated Circuit device having first contact balls over a bottom surface in addition to having a top surface;
- providing a heatsink for said Integrated Circuit device, a first surface of said heatsink being attached by adhesion to a flexible tape;
- providing a substrate on which to mount said Integrated Circuit device, said substrate having second contact balls over a bottom surface in addition to having a top surface;
- placing the IC device on top of the heatsink by bringing said top surface of said IC device in contact with a second surface of said heatsink, facing said first contact balls in an upward direction;
- placing said substrate on top of the first contact balls, facing said second contact balls in an upward direction, thereby;
- creating an enclosed space surrounding said Integrated Circuit device, two surfaces of said enclosed space comprising said first surface of said heatsink and said top surface of said substrate;
- providing forward motion to said flexible tape, thereby moving the IC device to a processing station for mold injection, said forward motion being provided by means of rotary motors;
- and
- filling the enclosed space around said Integrated Circuit device, including areas underneath the Integrated Circuit device, by injecting a mold compound into said enclosed space, thereby pressing said Integrated Circuit device firmly against a surface of said heatsink, said mold completely filling the enclosed space, thereby encapsulating the IC device including areas between the bottom of the IC device and the top of the substrate, forming an underfill for the IC device.
6 more elements
A method of packaging an Integrated Circuit (IC) device, comprising:
- providing an Integrated Circuit (IC) device having a flat first surface on which no points of input/output connect are provided for said IC device, having a flat second surface on which points of input/output connect comprising solder bumps or contact balls or contact pads are provided for said IC device;
- providing a heatsink having a flat first surface, further having a flat second surface, said second surface of said heatsink being attached by adhesion to a flexible tape;
- mounting said IC device on the first surface of said heatsink by joining said first surface of said IC device with said first surface of said heatsink, creating a first assembly;
- providing an IC substrate having a flat first surface, points of electrical interconnect comprising contact pads or via openings have been provided in or on said first surface, further having a second surface, points of electrical interconnect comprising solder bumps or contact balls or contact pads have been provided in or on said second surface;
- mounting said first assembly on said IC substrate by joining said solder bumps or contact balls or contact pads provided in or on said second surface of said IC device with said points of electrical interconnect provided in said first surface of said IC substrate, creating a second assembly;
- providing an enclosed space for said second assembly, said enclosed space enclosing said Integrated Circuit device, said enclosed space further having been provided with an opening through which a mold compound can be injected;
- providing forward motion to said flexible tape, thereby moving the second assembly to a processing station for mold injection, said forward motion being provided by means of rotary motors;
- and
- filling the enclosed space around said Integrated Circuit device, including the areas underneath the Integrated Circuit device, by injecting said mold compound into said enclosed space, thereby pressing said Integrated Circuit device firmly against a surface of said heatsink.
6 more elements
Dependencies are inferred from the claim text.