Method and apparatus for a lead-frame air-cavity package
AssigneeAzimuth Industrial Company, Inc.
InventorDavid Lee
Life of this patent
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Abstract
Embodiments provide a method, article of manufacture, and apparatus for providing a component package for components such as integrated circuits. In one embodiment, a carrier includes a plurality of sidewalls formed thereon to form a component package assembly. In one aspect, a cover is bonded to the component package assembly to form a plurality of separable individual component packages having a cavity therein, where each individual component package encapsulates at least one component disposed on the carrier. The component package assembly is then separated into individually packaged devices.
Claims12
A method of packaging at least one component, comprising:
- forming a component package including a plurality of component packages on a lead frame carrier wherein each of the plurality of component packages includes a cavity to receive the at least one component therein;
- mounting a component on the lead frame carrier in the cavity of each component package;
- applying a curable adhesive between said component packages and a top cover that spans all said component packages, said top cover including at least one vent hole corresponding to each cavity;
- curing said adhesive, said vent hole providing for the escape of water and other gasses that may off-gas during the curing process;
- sealing said vent holes with a curable material;
- curing said sealing material;
- and
- separating the component packages into a plurality of individually packaged components.
Dependencies are inferred from the claim text.