Semiconductor package with molded flash

A semiconductor package comprising:

• a substrate comprising a first surface and an opposing second surface;
• a plurality of conductors on the first surface;
• a semiconductor die on the second surface;
• a plurality of wire bonds between the die and the conductors;
• a first encapsulant on the first surface comprising a plastic material encapsulating the wire bonds;
• a second encapsulant on the second surface encapsulating the die;
• and
• a molded flash contained in a flash area on the first surface, the molded flash comprising the plastic material and the flash area having selected dimensions.

A semiconductor package comprising:

• a substrate comprising a first surface, an opposing second surface, and a wire bonding opening between the first surface and the second surface;
• a plurality of conductors on the first surface;
• a semiconductor die attached circuit side down to the second surface comprising a plurality of die contacts aligned with the wire bonding opening;
• a plurality of wires bonded to the die contacts and to the conductors;
• a die encapsulant on the second surface encapsulating the die;
• a wire bond encapsulant on the first surface comprising a molded plastic material encapsulating the wires;
• and
• a molded flash on the first surface comprising the molded plastic material contained in a flash area on the substrate having selected dimensions.

An electronic assembly comprising:

• a supporting substrate comprising a plurality of electrodes;
• and
• at least one semiconductor package on the substrate, the package comprising:
• a surface and a plurality of external contacts on the surface bonded to the electrodes;
• an encapsulant on the surface comprising a molded plastic material having a peripheral edge;
• and
• a molded flash on the substrate comprising the molded plastic material contained in a flash area on the substrate having selected dimensions and at least partially defined by the peripheral edge.