Packaging of multiple active optical devices

A method, comprising:

• heating a first active optoelectronic device die and a substrate to form a first composition of a gold-tin (Au—Sn) solder from a first eutectic Au—Sn solder composition disposed between the first active optoelectronic device die and the substrate whose melting temperature is greater than an eutectic temperature of the first eutectic Au—Sn solder composition disposed between the first active optoelectronic device die and the substrate;
• cooling the first zeta-phase composition of a gold-tin (Au—Sn) solder to bond the first active optoelectronic device die and to the substrate;
• and
• heating a second active optoelectronic device die and the substrate to form a second composition of a gold-tin (Au—Sn) solder from a second eutectic Au—Sn solder composition disposed between the second active optoelectronic device die and the substrate whose melting temperature is greater than an eutectic temperature of the second eutectic Au—Sn solder composition disposed between the second active optoelectronic device die and the substrate.

A method, comprising:

• heating a first active optoelectronic device die comprising a first gold-layered die bonding pad and a substrate having a first gold-layered substrate bonding pad disposed in a first well of the substrate to a melting temperature of a first eutectic Au—Sn solder layer disposed between the first gold-layered die bonding pad and the first gold-layered substrate bonding pad;
• heating the active optoelectronic device die and the substrate to form a zeta-phase composition of Au—Sn solder from the eutectic Au—Sn solder layer;
• cooling the zeta-phase composition of a gold-tin (Au—Sn) solder to bond the first active optoelectronic device die and to the substrate;
• and
• heating a second active optoelectronic device die and the substrate to form a second zeta-phase composition of a gold-tin (Au—Sn) solder from a second eutectic Au—Sn solder layer disposed between the second active optoelectronic device die and the substrate, the first active optoelectronic device die remaining bonded to the substrate during heating of the second active optoelectronic device die.

A method, comprising:

• heating a substrate to a first temperature;
• heating a photonic device die to a second temperature;
• aligning the photonic device die to an alignment position on the substrate;
• bringing the substrate and the photonic device die into contact with an eutectic composition of gold-tin (Au—Sn) solder disposed between the substrate and the photonic device die;
• transforming the eutectic composition of Au—Sn solder to a zeta-phase composition of gold-tin (Au—Sn) solder and bonding the photonic device to the substrate;
• and
• heating a second photonic device die and the substrate to a second temperature, the first photonic device remaining bonded to the substrate during heating of the second photonic device.