Metal substrate
AssigneeCalsonic Kansei Corporation
InventorHiroshi Tanabe
Life of this patent
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Abstract
A honeycomb structure brazed with an outer casing has a large corrugated foil and a small corrugated foil overlapped and wound alternately and formed like a cylinder by diffused junction. The large corrugated foil and the small corrugated foil has 20 μm in thickness. The honeycomb structure has 900 cells/square inches in cell density. The large corrugated foil has a wave height of 0.81 mm and a pitch of 1.71 mm. The small corrugated foil has a wave height of 0.05 mm to 0.18 mm and a pitch of 1.29 mm to 1.39 mm. Whereby the produced stress in each corrugated foil upon thermal expansion is reduced.
Claims7
A metal substrate comprising:
- an outer casing;
- and
- a honeycomb structure formed by overlapping and winding a large corrugated foil and a small corrugated foil, the honeycomb structure held in the outer casing,
- wherein the large corrugated foil and the small corrugated foil have thickness in a range of 18 μm to 22 μm;
- and
- wherein the honeycomb structure has cell density in a range of 810 cells/square inches to 990 cells/square inches.
Dependencies are inferred from the claim text.