Methods for detemplating zeolites and silicalites for use in integrated circuit manufacture
AssigneeNovellus Systems, Inc.
InventorsJustin F. Gaynor, Patrick Vancleemput
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AssigneeNovellus Systems, Inc.
InventorsJustin F. Gaynor, Patrick Vancleemput
Estimating the term…
Structure-directing agents, such as quaternary ammonium, are removed from silicalite or zeolite crystals by oxidative attack (e.g., using CO2, H2O or NH3) first, by using a combination of ammonia, water and hydrogen peroxide at an elevated temperature; second, by using choline, hydrogen peroxide and a surfactant; third, by using ozonated water; and fourth, by exposing the crystals to an oxygen-containing plasma. Thin porous films of silicalite or zeolite crystals are useful, for example, in forming low dielectric constant insulating layers in semiconductor chip fabrication. In order for the silicalite or zeolite crystals to form a low dielectric constant film, however, the entrained molecules of the structure-directing agent must be removed.
A method of removing a quaternary ammonia molecule from a colloidal suspension of silicalite or zeolite crystals in an aqueous suspension comprising:
A method of removing a quaternary ammonia molecule from a colloidal suspension of silicalite or zeolite crystals in an aqueous suspension comprising:
A method of removing a quaternary ammonia molecule from a colloidal solution of silicalite or zeolite crystals in an aqueous suspension comprising:
A method of removing a quaternary ammonia molecule from a colloidal suspension of silicalite or zeolite crystals in an aqueous suspension comprising:
A method of removing a quaternary ammonia molecule from a thin film or membrane comprising silicalite or zeolite crystals comprising exposing the film or membrane to an oxygen-containing plasma.
Dependencies are inferred from the claim text.