Microstructure elements and process for the production thereof
AssigneeSTEAG microParts GmbH
InventorsChristoph Lessmöllmann, Joachim Eicher, Holger Reinecke
Life of this patent
Estimating the term…
Abstract
A microstructured mold is produced from a solid body (metal, ceramic, glass, stone or monocrystalline material) by precision mechanical machining, additive or subtractive structuring. The mold insert is filled and covered by a flowable material and the solidified material is separated from the mold insert giving a microstructure element. The microstructure elements produced by the process have good material properties and can be prepared in a broad range of shapes and structures.
Claims14
A process for the production of a microstructured element, comprising the steps of:
- (a) forming a microstructure of a microstructured mold having an open cavity on one surface thereof from a solid body by mechanical machining, additive structuring or subtractive structuring, wherein said mold consists essentially of ceramic, glass, stone, quartz, gallium arsenide, germanium or a mixture thereof;
- (b) filling the cavity and covering the microstructured mold with a flowable plastic or sinterable material;
- (c) solidifying the flowable material which has filled and covered the microstructured mold;
- and
- (d) separating the solidified flowable material form the mold to provide a plastic or sintered material element having a microstructure complementary to the microstructured mold.
A microstructural element produced by a process comprising the steps of:
- (a) forming a microstructure of a microstructured mold having an open cavity on one surface thereof from a solid body by mechanical machining, additive structuring or subtractive structuring, wherein said mold consists essentially of ceramic, glass, stone, quartz, gallium arsenide, germanium or a mixture thereof;
- (b) filling the cavity and covering the microstructured mold with a flowable electrically non-conductive material;
- (c) solidifying the flowable electrically non-conductive material to form a solid layer in contact with the surface of the microstructured mold and filling the cavity;
- (d) removing a portion of the solid layer to expose the surface of the microstructured mold and the cavity filling with solidified flowable material;
- (e) applying a layer of conductive material to and covering the exposed surface of the mold and filled cavity;
- (f) separating the conductive layer and solidified flowable material in the cavity from the mold to provide a microstructure having a shape complementary to the mold;
- (g) electrodepositing a metal layer on the complementary microstructure;
- and
- (h) separating the metal layer from the complementary structure to provide a metallic microstructured element.
Dependencies are inferred from the claim text.