Plating apparatus and method

A plating unit comprising:

• a head having a rotatable housing;
• a vertically movable pressing member housed in said housing;
• a substrate holding member disposed in said housing for holding a peripheral portion of a substrate between said pressing member and said substrate holding member;
• and
• a plating process container disposed below said head for holding a plating solution so that the liquid surface of said plating solution has a liquid level for plating which is higher than a position of a substrate held by said housing, and a liquid level for transferring the substrate which is lower than a position of a substrate held by said housing.

A plating unit comprising:

• a head having a rotatable housing;
• a vertically movable pressing ring housed in said housing;
• a substrate holding member disposed in said housing for holding a peripheral portion of a substrate between said pressing ring and said substrate holding member;
• and
• a plating process container disposed below said head for holding a plating solution so that the liquid surface of said plating solution has a liquid level for plating which is higher than a position of a substrate held by said housing, and a liquid level for transferring the substrate which is lower than a position of a substrate held by said housing.

A plating unit comprising:

• a head having a rotatable housing;
• a clamp mechanism with a swing link housed in said housing, said swing link being swingable in the horizontal direction;
• a substrate holding member disposed in said housing for holding a peripheral portion of a substrate between said swing link and said substrate holding member;
• and
• a plating process container disposed below said head for holding a plating solution so that the liquid surface of said plating solution has a liquid level for plating which is higher than a position of a substrate held by said housing, and a liquid level for transferring the substrate which is lower than a position of a substrate held by said housing.

A plating unit comprising:

• a head having a rotatable housing, said housing having an elastic member therein elastically deformable by pneumatic pressure;
• a substrate holding member disposed in said housing for holding a peripheral portion of a substrate between said elastic member and said substrate holding member;
• and
• a plating process container disposed below said head for holding a plating solution so that the liquid surface of said plating solution has a liquid level for plating which is higher than a position of a substrate held by said housing, and a liquid level for transferring the substrate which is lower than a position of a substrate held by said housing.

A plating unit comprising:

• a head having a substrate holding member for holding a substrate;
• a plating process container disposed below said head for holding a plating solution;
• and
• a plating solution suction mechanism for removing a plating solution remaining at a portion abutting on the peripheral portion of a substrate at the inner circumferential end of said substrate holding member.