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US 6,660,071 B2Granted
Electroless copper plating bath, electroless copper plating method and electronic part
AssigneeMurata Manufacturing Co., Ltd.
InventorsYasushi Yoshida, Tatsuo Kunishi
Life of this patent
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Abstract
An electroless copper plating bath containing a cupric compound, a cupric ion complexing agent, a reducing agent, and a pH adjusting agent is provided, in which a carboxylic acid is added as a reaction accelerator to accelerate the oxidation reaction of the reducing agent. It does not need to use formaldehyde as the reducing agent yet it has a plating reaction velocity which is equivalent to that of a bath in which formaldehyde is contained as the reducing agent.
Claims15
An electroless copper plating bath comprising:
- a cupric compound;
- a cupric ion complexing agent;
- a reducing agent which is glyoxylic acid;
- a pH adjusting agent;
- and
- an oxidation reaction accelerator which is a carboxylic acid other than said glyoxylic acid.
3 more elements
Dependencies are inferred from the claim text.