Method of cleaning a probe card
AssigneePowerchip Semiconductor Corp.
InventorsYu-Hsin Liu, Kuang-Ping Tang
Life of this patent
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Abstract
A method of cleaning a probe card with probe pins contaminated by testing residue. A cleaning wafer is provided and the uneven surface and the grooves thereon are used to polish surfaces of the probe pins. Two kinds of cleaning operations, which utilize smaller and larger accelerations driving the cleaning wafer, are performed. The cleaning operations utilizing the smaller acceleration are used to polish the surfaces of the probe pins and the cleaning operations utilizing the larger acceleration are used to smooth the uneven surfaces of the probe pins after the former polishing operations. In addition, the cleaning wafer is rotated by various rotation angles to obtain superior cleaning.
Claims8
A probe-cleaning method for a probe card, comprising the steps of:
- providing a cleaning wafer;
- polishing a surface of a probe pin of the probe card by moving the cleaning wafer to contact with the surface of the probe pin with a first acceleration rate for a plurality of times;
- and
- smoothing the surface of the probe pin by moving the cleaning wafer to contact with the surface of the probe pin with a second acceleration rate for a plurality of times, wherein the second acceleration rate is faster than the first acceleration rate.
Dependencies are inferred from the claim text.