Grinding method, electronic component, and variable capacitor
AssigneeMurata Manufacturing Co., Ltd.
InventorsHiromichi Takeda, Hiroyuki Kishishita, Hidetoshi Kita, Keizo Morita
Life of this patent
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Abstract
A grinding method, in which the grinding operation is performed on a plurality of workpieces having different thicknesses with an end surface in the thickness direction of each workpiece being a surface to be ground, includes the steps of holding the workpieces with a holder such that the surfaces to be ground of the individual workpieces are aligned in the same plane, and grinding the surfaces to be ground of the workpieces while the workpieces are held by the holder. An electronic component provided with an element ground by the grinding method, and a variable capacitor provided with an element ground by the grinding method are also disclosed.
Claims20
A grinding method, in which a grinding operation is performed on a plurality of workpieces having different thicknesses with an end surface in the thickness direction of each workpiece being a surface to be ground, comprising the steps of:
- holding the plurality of workpieces with a holder such that the surfaces to be ground of the individual workpieces are aligned in the same plane;
- and
- grinding the surfaces to be ground of the workpieces while the workpieces are held by the holder.
An electronic component comprising an element ground by a grinding method in which a grinding operation is performed on a plurality of workpieces having different thicknesses with an end surface in the thickness direction of each workpiece being a surface to be ground, comprising the steps of:
- holding the plurality of workpieces with a holder such that the surfaces to be ground of the individual workpieces are aligned in the same plane;
- and
- grinding the surfaces to be ground of the workpieces while the workpieces are held by the holder.
A variable capacitor comprising an element around by a grinding method in which a grinding operation is performed on a plurality of workpieces having different thicknesses with an end surface in the thickness direction of each workpiece being a surface to be ground, comprising the steps of:
- holding the plurality of workpieces with a holder such that the surfaces to be ground of the individual workpieces are aligned in the same plane;
- and
- grinding the surfaces to be around of the workpieces while the workpieces are held by the holder.
A grinding method, in which the grinding operation is performed on a plurality of workpieces having different thicknesses with an end surface in the thickness direction of each workpiece being a surface to be ground, comprising the steps of:
- providing an aligning member having a planar alignment surface;
- aligning the workpieces with the aligning member while the surfaces to be ground of the individual workpieces are in contact with the alignment surface of the aligning member;
- providing a holder having a holding surface to hold the workpieces aligned by the aligning member on the surfaces opposed to the surfaces to be ground, and a first fixing agent to affix the individual workpieces to the holder;
- fixing the opposed surfaces of the workpieces to the holding surface of the holder via the first fixing agent;
- detaching the aligning member from the workpieces;
- and
- grinding the surfaces to be ground of the workpieces while the workpieces are fixed to the holder.
Dependencies are inferred from the claim text.