Multiple redundant through hole electrical interconnects and method for forming the same

The method for forming an electrical interconnect through a substrate wherein said electrical interconnect is for conveying electrical signals to a structure mounted on said substrate, said method comprising:

• a) receiving said substrate;
• b) forming a plurality of holes extending through said substrate, wherein said holes are formed without reducing the thickness of said substrate and wherein said holes have a diameter less than the diameter of electrical contacts on said structure;
• c) depositing a dielectric material in said holes such that said dielectric material coats the sidewalls of said holes;
• d) depositing a conducting material in said holes to form a plurality of electrical interconnects through said substrate such that said conducting material lines the sidewalls of said holes and said holes are not solidly filled;
• and
• e) coupling electrically said structure to said electrical interconnects such that said electrical signals are carried by redundant electrical paths.

A method for forming an electrical interconnect through a substrate wherein said electrical interconnect is for conveying electrical signals to an ink-jet, printhead structure mounted on said substrate in an ink-jet print cartridge, said method comprising:

• a) receiving said substrate;
• b) forming a hole extending through said substrate, wherein said hole is formed without reducing the thickness of said substrate and wherein said hole has a diameter less than the diameter of an electrical contact on said ink-jet printhead structure;
• c) depositing by atomic layer deposition a dielectric material in said hole such that said dielectric material coats the sidewalls of said hole;
• d) depositing by atomic layer deposition a conducting material in said hole to form said electrical interconnect through said substrate such that said conducting material lines the sidewalls of said hole and said hole is not solidly filled;
• and
• e) coupling electrically said ink-jet printhead structure to said electrical interconnect by forming a conductive layer on said substrate, said conductive layer operable to receive and selectively distribute to said ink-jet printhead structure said electrical signals conveyed through said substrate.