Method for producing a multi-layer chip card

A method for producing a chip card, which has a multi-layer plastic card body, an integrated circuit arranged in a chip module and at least two further electronic components, which are connected to one another and to the chip module by strip conductors arranged on a carrier layer and metallic contact surfaces connected to the strip conductors, comprising the following method steps:

• arrangement of at least two covering layers over the strip conductor carrier layer by the conductor's upper side facing the etectronic components and the chip module, the covering layers each being provided with clearances,
• positioning of the covering layers over the strip conductor carrier layer in such a way that the clearances located in the individual covering layers are arranged over the metallic contact surfaces and partly over one another,
• placement of at least one thickness compensating layer covering the covering layers,
• lamination of the card layers laid one on top of the other in a laminating press under the influence of pressure and heat, the metallic contact surfaces being pressed up within the clearances arranged over the metallic contact surfaces of the covering layers until the metallic contact surfaces come to bear against a covering layer or a thickness compensating layer,
• milling of clearances of different depths into the laminated plastic card body after removal of the laminated plastic card body from the laminating press, the metallic contact surfaces located within the card body at different depths being exposed, and
• insertion of the chip module and the other electronic components into the milled clearances of the card body and establishment of electrically conducting connections between the contact surfaces and corresponding connecting areas of the chip module and of the electronic components.