Method for forming end-face electrode
AssigneeMurata Manufacturing Co., Ltd.
InventorsHiroaki Mouri, Joji Shibata
Life of this patent
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Abstract
There is provided a method for forming end-face electrodes in which the end-face electrode can be securely formed with solder at a position in which a side electrode is formed and it can be formed without being affected by a jig for fixing a solder solid. By forming linear gaps on a master substrate, module substrates and a waste substrate are formed. At the side end of the gap of the module substrate, a side electrode is formed. A solder solid is pressed into the part of the gap in which the side electrode is formed and a reflow jig is placed. The surface of the solder solid is coated with flux and the solder solid is melted by heating so as to form the end-face electrode protruding from the substrate surface in the side electrode.
Claims9
A method for forming end-face electrodes comprising the steps of:
- preparing a substrate having gaps with side electrodes, each side electrode being formed at one of side ends opposing each other via the gap;
- pressing a solder solid into the gap of the substrate in order to hold the solder solid in the area where the side electrode is provided within the gap;
- and
- forming an end-face electrode on the side electrode by heating the substrate to melt the solder solid such that the end-face electrode protrudes from the substrate surface.
Dependencies are inferred from the claim text.