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US 6,659,003 B2Granted
Stencil plate
AssigneeRiso Kagaku Corporation
InventorsJun Nakamura, Shoichi Ikejima
Life of this patent
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AssigneeRiso Kagaku Corporation
InventorsJun Nakamura, Shoichi Ikejima
Estimating the term…
A perforation pattern is provided with a stencil plate, which is decreased in perforation configuration irregularity and has an adequate size of perforations. The stencil plate is produced from a heat sensitive stencil sheet having a heat shrinkable film by selectively heating the film with a heating device to form independent dot perforations corresponding to an image in the film, and each of the perforations has a through hole and a rim surrounding the through hole and bulging on a heated side of the film, and the rim has a height that satisfies the following formulae (1) and (2): h≦4 (μm) (1) h≦0.05{square root over ( )}(pxpy)(μm) (2) where h denotes the height (μm) in reference to the surface of the film before heated, px and py respectively denote pitches (μm) in main and sub scanning directions of the heating device.
A stencil plate which comprises a heat shrinkable film having independent dot perforations corresponding to an image, said perforations being formed by selectively heating said film with a heating device, wherein each of said perforations has a through hole and a rim surrounding said through hole and bulging on a heated side of said film, and said rim has a height that satisfies the following formulae (1) and (2):
Dependencies are inferred from the claim text.