Method of manufacturing a circuit member for a resin-sealed semiconductor device

A method of manufacturing a resin-sealed semiconductor device, comprising:

• forming a circuit member by half-etching a conductive board such that the circuit member includes plural circuit portions having inner and outer terminals integrally connected by leads and being arranged two-dimensionally along a plane and electrically independent of one another, said inner terminals and said leads being thinner than said outer terminals;
• mounting a semiconductor element on top surfaces of said plural circuit portions with an insulating layer disposed therebetween;
• electrically connecting top surfaces of said inner terminals to terminals of said semiconductor element with wires;
• and
• completely sealing said semiconductor device with a resin in such a manner that bottom surfaces of said outer terminals are partially exposed,
• wherein said device is configured as a chip size package (CSP) having a chip on lead (COL) structure, and
• wherein said outer terminals, said leads and a portion of said inner terminals of the circuit portions are directly underneath the semiconductor element with the insulating layer disposed therebetween.